Invention Grant
- Patent Title: Resistive materials for microbolometer, method for preparation of resistive materials and microbolometer containing the resistive materials
- Patent Title (中): 微电热计的电阻材料，电阻材料的制备方法和含电阻材料的微电热计
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Application No.: US12182496Application Date: 2008-07-30
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Publication No.: US07696478B2Publication Date: 2010-04-13
- Inventor: Ho Jun Ryu , Woo Seok Yang , Seong Mok Cho , Sang Hoon Cheon , Byoung Gon Yu , Chang Auck Choi
- Applicant: Ho Jun Ryu , Woo Seok Yang , Seong Mok Cho , Sang Hoon Cheon , Byoung Gon Yu , Chang Auck Choi
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunication Research Institute
- Current Assignee: Electronics and Telecommunication Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2007-0126847 20071207
- Main IPC: G01J5/00
- IPC: G01J5/00
Abstract:
Provided are resistive materials for a microbolometer, a method for preparation of resistive materials and a microbolometer containing the resistive materials. The resistive materials for the microbolometer include an alloy of silicon and antimony or an alloy of silicon, antimony and germanium, which has a high TCR and a low resistance.
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