Invention Grant
- Patent Title: Wiring substrate, electronic device, electro-optical device, and electronic apparatus
- Patent Title (中): 接线基板，电子设备，电光器件和电子设备
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Application No.: US11512119Application Date: 2006-08-30
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Publication No.: US07696519B2Publication Date: 2010-04-13
- Inventor: Takashi Miyazawa
- Applicant: Takashi Miyazawa
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-079509 20020320
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
The invention achieves stable performance, such as low parasitic capacitance generated at conductive components. Components having a low dielectric constant of 4 or less are disposed on a base member. Functional films partitioned by the low-dielectric-constant components are also provided.
Public/Granted literature
- US20060289872A1 Wiring substrate, electronic device, electro-optical device, and electronic apparatus Public/Granted day:2006-12-28
Information query
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