Provided is a light source that has high reliability and hardly causes conductivity failure between a light emitting device and a conductive land. In an LED light source of the present invention, an LED bare chip is mounted to conductive lands of a substrate, using bumps (55a, 55b). The LED bare chip (D65) is provided with a p-electrode (Lp) and an n-electrode (Ln) on a rear surface. The p-electrode (Lp) is larger in area than the n-electrode (Ln). The p-electrode (Lp) is bonded to a corresponding conductive land via four bumps (55a), whereas the n-electrode (Ln) is bonded to a corresponding conductive land via one bump (55b). A bonded area (Sn) between the n-electrode (Ln) and the bump (55b) is larger than a bonded area (Sp) between the p-electrode (Lp) and one of the bumps (55a).