Invention Grant
- Patent Title: Structure and method for a fast recovery rectifier structure
- Patent Title (中): 快速恢复整流器结构的结构和方法
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Application No.: US11644578Application Date: 2006-12-22
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Publication No.: US07696540B2Publication Date: 2010-04-13
- Inventor: Richard Francis , Yang Yu Fan , Eric Johnson , Hy Hoang
- Applicant: Richard Francis , Yang Yu Fan , Eric Johnson , Hy Hoang
- Applicant Address: US CA Santa Clara
- Assignee: Qspeed Semiconductor Inc.
- Current Assignee: Qspeed Semiconductor Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01L29/80
- IPC: H01L29/80

Abstract:
An apparatus and method for a fast recovery rectifier structure. Specifically, the structure includes a substrate of a first dopant. A first epitaxial layer lightly doped with the first dopant is coupled to the substrate. A first metallization layer is coupled to the first epitaxial layer. A plurality of trenches is recessed into the first epitaxial layer, each of which is coupled to the metallization layer. The device also includes a plurality of wells each doped with a second dopant type, wherein each well is formed beneath and adjacent to a corresponding trench. A plurality of oxide layers is formed on walls and a bottom of a corresponding trench. A plurality of channel regions doped with the first dopant is formed within the first epitaxial layer between two corresponding wells. Each of the plurality of channel regions is more highly doped with the first dopant than the first epitaxial layer.
Public/Granted literature
- US20070145429A1 Structure and method for a fast recovery rectifier structure Public/Granted day:2007-06-28
Information query
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