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US07696564B1 Lateral diffused metal-oxide-semiconductor field-effect transistor 失效
横向扩散金属氧化物半导体场效应晶体管

Lateral diffused metal-oxide-semiconductor field-effect transistor
Abstract:
A lateral diffused metal-oxide-semiconductor field-effect transistor structure including a P substrate, an N+ buried layer, an N epitaxial layer, a P well, an N well, a drain region, a source region, and a body region is disclosed. The N+ buried layer is located between the P substrate and the N epitaxial layer, the P well contacts the N+ buried layer, the source region and the body region are located in the P well, the N well is located in the N epitaxial layer, and the drain region is located in the N well. When a high voltage is applied to the drain and the P substrate is grounded, a breakdown voltage with the P substrate is raised because of the N+ buried layer isolating the P substrate from the N epitaxial layer, so as to be able to avoid PN junction breakdown.
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