Invention Grant
US07696564B1 Lateral diffused metal-oxide-semiconductor field-effect transistor
失效
横向扩散金属氧化物半导体场效应晶体管
- Patent Title: Lateral diffused metal-oxide-semiconductor field-effect transistor
- Patent Title (中): 横向扩散金属氧化物半导体场效应晶体管
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Application No.: US12436120Application Date: 2009-05-06
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Publication No.: US07696564B1Publication Date: 2010-04-13
- Inventor: Tsuoe-Hsiang Liao , Bing-Yao Fan , Yi-Ju Liu
- Applicant: Tsuoe-Hsiang Liao , Bing-Yao Fan , Yi-Ju Liu
- Applicant Address: TW Hsinchu
- Assignee: Agamem Microelectronics Inc.
- Current Assignee: Agamem Microelectronics Inc.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94

Abstract:
A lateral diffused metal-oxide-semiconductor field-effect transistor structure including a P substrate, an N+ buried layer, an N epitaxial layer, a P well, an N well, a drain region, a source region, and a body region is disclosed. The N+ buried layer is located between the P substrate and the N epitaxial layer, the P well contacts the N+ buried layer, the source region and the body region are located in the P well, the N well is located in the N epitaxial layer, and the drain region is located in the N well. When a high voltage is applied to the drain and the P substrate is grounded, a breakdown voltage with the P substrate is raised because of the N+ buried layer isolating the P substrate from the N epitaxial layer, so as to be able to avoid PN junction breakdown.
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