Invention Grant
- Patent Title: Semiconductor device and method of manufacture thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11668694Application Date: 2007-01-30
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Publication No.: US07696575B2Publication Date: 2010-04-13
- Inventor: Masakatsu Tsuchiaki
- Applicant: Masakatsu Tsuchiaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-024883 20060201
- Main IPC: H01L27/085
- IPC: H01L27/085

Abstract:
A semiconductor device of complementary structure with increased carrier mobilities of both polarities by applying orientation-dependent mechanical stresses to their respective semiconductor channel regions, comprises a semiconductor region subjected to compressive stress in a first direction along a surface and tensile stress in a second direction different from the first direction, a field effect transistor of a first conductivity type formed in the semiconductor region and including source and drain regions separately arranged along the first direction and a field effect transistor of a second conductivity type formed in the semiconductor region and including source and drain regions separately arranged along the second direction.
Public/Granted literature
- US20070176209A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2007-08-02
Information query
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