Invention Grant
US07696600B2 IGBT device and related device having robustness under extreme conditions
有权
IGBT器件及相关器件在极端条件下具有鲁棒性
- Patent Title: IGBT device and related device having robustness under extreme conditions
- Patent Title (中): IGBT器件及相关器件在极端条件下具有鲁棒性
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Application No.: US11713226Application Date: 2007-03-02
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Publication No.: US07696600B2Publication Date: 2010-04-13
- Inventor: Anton Mauder , Hans-Joachim Schulze , Frank Pfirsch , Elmar Falck , Josef Lutz
- Applicant: Anton Mauder , Hans-Joachim Schulze , Frank Pfirsch , Elmar Falck , Josef Lutz
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Maginot, Moore & Beck
- Priority: DE10361136 20031223
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/72

Abstract:
A semiconductor device in the form of an IGBT has a front side contact, a rear side contact, and a semiconductor volume disposed between the front side contact and the rear side contact. The semiconductor volume includes a field stop layer for spatially delimiting an electric field that can be formed in the semiconductor volume. The semiconductor volume further includes a plurality of semiconductor zones, the plurality of semiconductor zones spaced apart from each other and each inversely doped with respect to adjacent areas. The plurality of semiconductor zones are located within the field stop layer.
Public/Granted literature
- US20070170514A1 IGBT device and related device having robustness under extreme conditions Public/Granted day:2007-07-26
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