Invention Grant
- Patent Title: Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same
- Patent Title (中): 包括布线层和绝缘层的多层布线基板及其制造方法
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Application No.: US11515803Application Date: 2006-09-06
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Publication No.: US07696613B2Publication Date: 2010-04-13
- Inventor: Junichi Nakamura , Kinji Nagata
- Applicant: Junichi Nakamura , Kinji Nagata
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2005-259724 20050907
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/498 ; H01L23/12 ; B32B25/10 ; H05K3/46 ; H05K1/02
Abstract:
A multilayered wiring substrate is constructed by stacking wiring layers 105, 108, 110, 112 and insulating layers 104, 106, 107, 109 in predetermined number, with at least one of the wiring layers being formed as a reinforcing wiring layer 103 whose thickness is 35 to 150 μm arranged in one layer or plural layers. Also, the thickness of the reinforcing wiring layer is larger than that of the other wiring layers.
Public/Granted literature
- US20070057363A1 Multilayered wiring substrate and method of manufacturing the same Public/Granted day:2007-03-15
Information query
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