Invention Grant
- Patent Title: Semiconductor device having pillar-shaped terminal
- Patent Title (中): 具有柱状端子的半导体器件
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Application No.: US11776497Application Date: 2007-07-11
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Publication No.: US07696615B2Publication Date: 2010-04-13
- Inventor: Jun-Young Ko , Dae-Sang Chan , Wha-Su Sin
- Applicant: Jun-Young Ko , Dae-Sang Chan , Wha-Su Sin
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2006-0065988 20060713
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119
Abstract:
A semiconductor device and a method of forming the same are provided. A semiconductor chip included in the semiconductor device includes a pillar-shaped terminal and a pad-shaped terminal in a terminal region. The pillar-shaped terminal is exposed at a first surface of a chip substrate in the terminal region and the pad-shaped terminal is exposed at a second surface of the chip substrate in the terminal region, where the first surface and the second surface of the chip substrate in the terminal region face oppositely from each other.
Public/Granted literature
- US20080012116A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2008-01-17
Information query
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