A first conductive contact connecting a first electrode of an inspection circuit board and one external electrode of a semiconductor integrated circuit is arranged in a fixed member. A second conductive contact connecting a second electrode of a wiring board and the other external electrode of the semiconductor integrated circuit is arranged in a movable member. A third conductive contact connecting one third electrode of the inspection circuit board and the other third electrode of the wiring board is arranged in the movable member. The other third electrode is connected to the second electrode. When the movable member moves to the contacting position, the second conductive contact makes contact with the other external electrode, and the third conductive contact makes contact with the one third electrode.