Invention Grant
- Patent Title: Strip socket for testing and burn-in having recessed portions with material that extends across a bottom surface of the corresponding semiconductor device
- Patent Title (中): 用于测试和老化的带插座，其具有延伸穿过相应半导体器件的底表面的材料的凹部
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Application No.: US12080677Application Date: 2008-04-04
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Publication No.: US07696772B2Publication Date: 2010-04-13
- Inventor: Saruch Sangaunwong , Prayoch Tayaphat , Pinut Boonareeroj
- Applicant: Saruch Sangaunwong , Prayoch Tayaphat , Pinut Boonareeroj
- Applicant Address: TH Bangna Bangkok
- Assignee: NS Electronics Bangkok Ltd
- Current Assignee: NS Electronics Bangkok Ltd
- Current Assignee Address: TH Bangna Bangkok
- Agency: Haverstock & Owens LLP
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/26
Abstract:
A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
Public/Granted literature
- US20080188015A1 Testing and burn-in using a strip socket Public/Granted day:2008-08-07
Information query
