Invention Grant
- Patent Title: Enclosure foot assembly and manufacture
- Patent Title (中): 封闭脚组件和制造
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Application No.: US12241016Application Date: 2008-09-29
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Publication No.: US07697283B2Publication Date: 2010-04-13
- Inventor: Dinesh Mathew , Brett William Degner , Thomas W. Wilson, Jr. , John Brock
- Applicant: Dinesh Mathew , Brett William Degner , Thomas W. Wilson, Jr. , John Brock
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kramer Levin Naftalis & Frankel LLP
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
Wall portions, such as wall portions of electronic device housing components, are provided with one or more foot assemblies. A foot assembly can be formed by creating an internal cavity in an internal surface of the wall portion, an external cavity in an external surface of the wall portion, and a hollow passageway extending through the wall portion and between the cavities. The foot assembly can be completed by inserting a foot at least partially through the external cavity and hollow passageway and into the internal cavity, such that an external portion of the foot is at least partially contained within and contacting the surfaces of the external cavity, and such that an internal portion of the foot is at least partially contained within the internal cavity. A portion of the foot may be deformable to at least partially conform to the surfaces defining the internal cavity.
Public/Granted literature
- US20090175001A1 ENCLOSURE FOOT ASSEMBLY AND MANUFACTURE Public/Granted day:2009-07-09
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