Invention Grant
US07697303B2 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
有权
双面基板集成电路封装，包括具有增加厚度的引线的引线框架
- Patent Title: Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness
- Patent Title (中): 双面基板集成电路封装，包括具有增加厚度的引线的引线框架
-
Application No.: US12150070Application Date: 2008-04-24
-
Publication No.: US07697303B2Publication Date: 2010-04-13
- Inventor: Roger A Mock , Erich W. Gerbsch
- Applicant: Roger A Mock , Erich W. Gerbsch
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: H05K5/02
- IPC: H05K5/02
Abstract:
An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.
Public/Granted literature
Information query
