Invention Grant
- Patent Title: Light receiving device and optically interconnected LSI
- Patent Title (中): 光接收装置和光互连LSI
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Application No.: US12146771Application Date: 2008-06-26
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Publication No.: US07697799B2Publication Date: 2010-04-13
- Inventor: Hideto Furuyama
- Applicant: Hideto Furuyama
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-167420 20070626
- Main IPC: G02B6/12
- IPC: G02B6/12

Abstract:
A light receiving device includes a first receiving structure and a second receiving structure. The first receiving structure has a first concentric coupling periodic structure provided in a first surface of a conductive thin film formed on a substrate, a first opening located at a center of the first concentric coupling periodic structure, and a first light receiving section located at an opening end of the first opening. The second receiving structure has a second concentric coupling periodic structure provided in the first surface of the conductive thin film, a second opening located at a center of the second concentric coupling periodic structure, and a second light receiving section located at an opening end of the second opening. The second light receiving section is electrically isolated from the first light receiving section.
Public/Granted literature
- US20090010593A1 LIGHT RECEIVING DEVICE AND OPTICALLY INTERCONNECTED LSI Public/Granted day:2009-01-08
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