A cooling system for an electrical component, comprises: a substrate having a mounting surface on which an electrical component is mounted; an air sucking section that takes in air for cooling the electrical component; a first guide member comprising a first guide surface that leads the air taken into the air sucking section in such a direction as to be separated from the mounting surface of the substrate; and a second guide member comprising a second guide surface that leads, to the mounting surface of the substrate, the air led to the first guide surface.