Invention Grant
- Patent Title: Interface test circuitry and methods
- Patent Title (中): 接口测试电路和方法
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Application No.: US11742358Application Date: 2007-04-30
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Publication No.: US07698088B2Publication Date: 2010-04-13
- Inventor: Chinsong Sul , Heon C. Kim , Gijung Ahn
- Applicant: Chinsong Sul , Heon C. Kim , Gijung Ahn
- Applicant Address: US CA Sunnyvale
- Assignee: Silicon Image, Inc.
- Current Assignee: Silicon Image, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Blakely Sokoloff Taylor & Zafman LLP
- Main IPC: G06F3/01
- IPC: G06F3/01

Abstract:
In some embodiments, an apparatus includes conductors, and a transmitter including transmitter test circuitry to embed test properties in test pattern signals, and transmit the test pattern signals to the conductors. In some embodiments, an apparatus includes conductors to carry test pattern signals with embedded test properties, and receiver test circuitry to receive the test pattern signals and extract the test properties and determine whether the extracted test properties match expected test properties. Other embodiments are described and claimed.
Public/Granted literature
- US20080114562A1 INTERFACE TEST CIRCUITRY AND METHODS Public/Granted day:2008-05-15
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