Invention Grant
- Patent Title: CPU power delivery system
- Patent Title (中): CPU供电系统
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Application No.: US10955746Application Date: 2004-09-30
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Publication No.: US07698576B2Publication Date: 2010-04-13
- Inventor: Siva G. Narendra , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
- Applicant: Siva G. Narendra , Howard A. Wilson , Donald S. Gardner , Peter Hazucha , Gerhard Schrom , Tanay Karnik , Nitin Borkar , Vivek K. De , Shekhar Y. Borkar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G06F1/26
- IPC: G06F1/26
Abstract:
A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout.
Public/Granted literature
- US20060099734A1 CPU power delivery system Public/Granted day:2006-05-11
Information query
