Invention Grant
- Patent Title: Biasing assembly for a punching device
- Patent Title (中): 用于冲压装置的偏压组件
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Application No.: US10945929Application Date: 2004-09-22
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Publication No.: US07698979B2Publication Date: 2010-04-20
- Inventor: Fumitaka Sugizaki , Hitoshi Iizuka , Edward A. Dries
- Applicant: Fumitaka Sugizaki , Hitoshi Iizuka , Edward A. Dries
- Applicant Address: US NY Batavia
- Assignee: Amada Tool America, Inc.
- Current Assignee: Amada Tool America, Inc.
- Current Assignee Address: US NY Batavia
- Agency: Blank Rome LLP
- Main IPC: B26D7/26
- IPC: B26D7/26 ; B26F1/14 ; B26D7/18

Abstract:
A biasing assembly for a punching device that includes a punch support member adapted to support a punch and including a head portion and a main portion extending from the head portion. The main portion has a recessed surface. A retaining member is coupled to the punch support member with the punch support member being slidable with respect to the retaining member. A coupling member is disposed between the main portion of the punch support member and the retaining member. A portion of the coupling member engages the recessed surface. A biasing member is supported between the head portion of the punch support member and the retaining member. The punch support member is movable between at least first and second positions with respect to the coupling member.
Public/Granted literature
- US20060060046A1 Biasing assembly for a punching device Public/Granted day:2006-03-23
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