Invention Grant
- Patent Title: Liquid jetting apparatus and liquid jetting method
- Patent Title (中): 液体喷射装置和液体喷射方法
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Application No.: US11868319Application Date: 2007-10-05
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Publication No.: US07699418B2Publication Date: 2010-04-20
- Inventor: Yue Gao , Katsuhiro Okubo
- Applicant: Yue Gao , Katsuhiro Okubo
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-076891 20040317; JP2004-085586 20040323
- Main IPC: B41J25/308
- IPC: B41J25/308 ; B41J29/38 ; B41J29/393

Abstract:
A liquid jetting apparatus and a liquid jetting method are achieved that can prevent unexpected landing position displacement relating to satellite droplets. For example, the liquid jetting apparatus includes a head in which a nozzle row constituted by a plurality of nozzles lined up in a row is arranged at a medium-opposing surface which is in opposition to a medium, a head movement section that moves the head in a predetermined direction along a surface of the medium, a spacing adjustment section that adjusts a spacing between the head and the medium, and an ejection control section that carries out ejection control of a liquid by determining at least one non-ejection nozzle among a plurality of nozzles sandwiched between a nozzle at one end of the nozzle row and a nozzle at another end thereof, the non-ejection nozzle being a nozzle which is caused not to eject liquid, the number of the non-ejection nozzle being determined according to a spacing from the medium-opposing surface to the surface of the medium.
Public/Granted literature
- US20080030531A1 LIQUID JETTING APPARATUS AND LIQUID JETTING METHOD Public/Granted day:2008-02-07
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