Invention Grant
- Patent Title: High density planar electrical interface
- Patent Title (中): 高密度平面电接口
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Application No.: US12034110Application Date: 2008-02-20
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Publication No.: US07699616B2Publication Date: 2010-04-20
- Inventor: Charles A. Miller , Benjamin N. Eldridge
- Applicant: Charles A. Miller , Benjamin N. Eldridge
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: H01R29/00
- IPC: H01R29/00

Abstract:
An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor and terminates about a surface of the substrate such that the conductors of respective ones of plurality of cables are planarly aligned and available for electrical contact. A system including a cable interface extending through respective ones of a plurality of through holes of a body of the interface; an interconnection component comprising a first plurality of contact points aligned with respective ones of conductors of the plurality of cables and a second plurality of contact points aligned to corresponding contact points of a device to be tested. Also, a method of routing signals through the conductors of the plurality of cables between electronic components.
Public/Granted literature
- US20080150571A1 HIGH DENSITY PLANAR ELECTRICAL INTERFACE Public/Granted day:2008-06-26
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