Invention Grant
- Patent Title: Process for making contact with and housing integrated circuits
- Patent Title (中): 与集成电路接触和接收的过程
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Application No.: US10947974Application Date: 2004-09-22
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Publication No.: US07700957B2Publication Date: 2010-04-20
- Inventor: Florian Bieck , Jürgen Leib
- Applicant: Florian Bieck , Jürgen Leib
- Applicant Address: DE Mainz
- Assignee: Schott AG
- Current Assignee: Schott AG
- Current Assignee Address: DE Mainz
- Agency: Ohlandt, Greeley, Ruggiero & Perle, L.L.P.
- Priority: DE10141558 20010824; DE10141571 20010824; DE10225373 20020606
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
The invention proposes a process for producing electrical contact connections for at least one component which is integrated in a substrate material, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages. Very advantageously, it is in this way possible for a contact location to be produced on the terminal contact and therefore a contact location which is electrically connected to the terminal contact can be produced on that side of the substrate material which is remote from the active surface, it being possible to dispense both with trenches which run along the substrate material and with a lateral contact which leads around the component in accordance with the prior art.
Public/Granted literature
- US20050042786A1 Process for making contact with and housing integrated circuits Public/Granted day:2005-02-24
Information query
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