Invention Grant
- Patent Title: Solid-state image pickup device
- Patent Title (中): 固态图像拾取装置
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Application No.: US10440683Application Date: 2003-05-19
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Publication No.: US07701029B2Publication Date: 2010-04-20
- Inventor: Keiji Mabuchi
- Applicant: Keiji Mabuchi
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons, LLC
- Agent Robert J. Depke
- Priority: JPP2002-144886 20020520
- Main IPC: H01L31/113
- IPC: H01L31/113

Abstract:
In a rear surface incidence type CMOS image sensor having a wiring layer 720 on a first surface (front surface) of an epitaxial substrate 710 in which a photodiode, a reading circuit (an n-type region 750 and an n+ type region 760) and the like are disposed, and a light receiving plane in a second surface (rear surface), the photodiode and a P-type well region 740 on the periphery of the photodiode are disposed in a layer structure that does not reach the rear surface (light receiving surface) of the substrate, and an electric field is formed within the substrate 710 to properly lead electrons entering from the rear surface (light receiving surface) of the substrate to the photodiode. The electric field is realized by providing a concentration gradient in a direction of depth of the epitaxial substrate 710. Alternatively, the electric field can be realized by providing a rear-surface electrode 810 or 840 for sending a current.
Public/Granted literature
- US20030214595A1 Solid-state image pickup device Public/Granted day:2003-11-20
Information query
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