Invention Grant
- Patent Title: Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated
- Patent Title (中): 制造半导体封装的方法，其能够在加热时灌封热固性树脂
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Application No.: US11708582Application Date: 2007-02-21
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Publication No.: US07701067B2Publication Date: 2010-04-20
- Inventor: Mitsunobu Habe
- Applicant: Mitsunobu Habe
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2006-045682 20060222
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
In an apparatus for manufacturing a semiconductor package including a semiconductor chip electronically and mechanically mounted on a tape-automated bonding tape, a resin potting unit is adapted to pot thermosetting resin into a gap between the semiconductor chip and the tape-automated bonding tape while the semiconductor chip and the tape-automated bonding tape are heated.
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