Invention Grant
- Patent Title: Electronic circuit package
- Patent Title (中): 电子电路封装
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Application No.: US12222329Application Date: 2008-08-07
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Publication No.: US07701743B2Publication Date: 2010-04-20
- Inventor: Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
- Applicant: Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
- Applicant Address: US TX Austin
- Assignee: Rising Silicon, Inc.
- Current Assignee: Rising Silicon, Inc.
- Current Assignee Address: US TX Austin
- Agency: Marger Johnson & McCollom, P.C.
- Main IPC: G11C5/06
- IPC: G11C5/06
Abstract:
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
Public/Granted literature
- US20080303175A1 Electronic circuit package Public/Granted day:2008-12-11
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