Invention Grant
- Patent Title: Process for depopulating a circuit board
- Patent Title (中): 减少电路板的过程
-
Application No.: US11174182Application Date: 2005-07-01
-
Publication No.: US07703197B2Publication Date: 2010-04-27
- Inventor: James R. Moltion
- Applicant: James R. Moltion
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces that dislodge the components to be removed from the circuit board. In one embodiment, the electromagnetic radiation is supplied by heaters operating at color temperatures in the vicinity of 973 Kelvin. The components are recovered in a form that allows their reuse.
Public/Granted literature
- US20070004290A1 Apparatus and process for circuit board depopulation Public/Granted day:2007-01-04
Information query