Invention Grant
- Patent Title: Printed wiring board and electric device using the same
- Patent Title (中): 印刷电路板和使用其的电气设备
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Application No.: US11113459Application Date: 2005-04-25
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Publication No.: US07703889B2Publication Date: 2010-04-27
- Inventor: Hirosumi Ito
- Applicant: Hirosumi Ito
- Applicant Address: JP Aichi-Ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Aichi-Ken
- Agency: Frommer Lawrence & Haug LLP
- Priority: JPP2004-130061 20040426
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/05

Abstract:
There is disclosed a printed wiring board comprising: an electrically insulating flexible layer which has on one of its opposite sides a protrusion which forms a corresponding recess on the other side of the flexible layer; an electrically conducting layer formed on the protrusion; and a wire formed on the flexible layer, connected to the conducting layer, and extending in a direction. The conducting layer has a shape long in the direction of extension of the wire.
Public/Granted literature
- US20050237364A1 Printed wiring board and electric device using the same Public/Granted day:2005-10-27
Information query
IPC分类: