Invention Grant
- Patent Title: Low loss board to board connection system
- Patent Title (中): 低损耗板对板连接系统
-
Application No.: US12422837Application Date: 2009-04-13
-
Publication No.: US07704077B1Publication Date: 2010-04-27
- Inventor: Stephen T Morley
- Applicant: Stephen T Morley
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
A board to board connection system is disclosed for RF signals, and comprises coaxial interconnection systems which interconnect a daughter card to a backplane.
Information query
