Invention Grant
- Patent Title: Through board inverted connector
- Patent Title (中): 通过板反向连接器
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Application No.: US12144241Application Date: 2008-06-23
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Publication No.: US07704082B2Publication Date: 2010-04-27
- Inventor: Christopher G. Daily , Matthew Mostoller
- Applicant: Christopher G. Daily , Matthew Mostoller
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A connector assembly is configured to be mounted to a substrate that has an opening extending between a mounting side and an opposite side. The connector assembly includes a housing and one or more contacts. The housing has a front end and a back end, with an interior chamber extending inward from a mating interface. The front end of the housing is configured to be partially inserted through the opening in the substrate until a housing mounting surface engages the mounting side of the substrate. The contact extends between a mating end and a contact mounting surface. The contact mounting surface is configured to be mounted to the mounting side of the substrate. The housing and contact mounting surfaces are substantially coplanar in a mourning plane, and a distance between the mating interface and the mounting plane is at least as great as a thickness of the substrate.
Public/Granted literature
- US20090317989A1 THROUGH BOARD INVERTED CONNECTOR Public/Granted day:2009-12-24
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