Invention Grant
- Patent Title: Connection structure connecting an LED component
- Patent Title (中): 连接LED组件的连接结构
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Application No.: US12435088Application Date: 2009-05-04
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Publication No.: US07704094B2Publication Date: 2010-04-27
- Inventor: Masanobu Sato , Kenichi Shibata , Yoshisada Sano , Noritsugu Enomoto , Takenobu Yabu , Naobumi Kuboki , Shigeki Motomura , Takehide Ikeda
- Applicant: Masanobu Sato , Kenichi Shibata , Yoshisada Sano , Noritsugu Enomoto , Takenobu Yabu , Naobumi Kuboki , Shigeki Motomura , Takehide Ikeda
- Applicant Address: JP Kariya-shi JP Tokyo JP Inukami-gun
- Assignee: Toyota Boshoku Kabushiki Kaisha,The Furukawa Electric Co., Ltd.,Furukawa Automotive Systems Inc.
- Current Assignee: Toyota Boshoku Kabushiki Kaisha,The Furukawa Electric Co., Ltd.,Furukawa Automotive Systems Inc.
- Current Assignee Address: JP Kariya-shi JP Tokyo JP Inukami-gun
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-135331 20080523
- Main IPC: H01R4/24
- IPC: H01R4/24

Abstract:
The present invention has an object of providing a connection structure capable of easily connecting an LED component to a flat cable. An LED unit 1 includes an upper case 7, a pierce terminal 6, a lower case 9 and an intermediate terminal 5. An LED chip 3 is pressed to the pierce terminal 6 by a convexed spring 51 to electrically connect the LED chip 3 to the flat cable 100. Conductors 101 included in the flat cable 100 are formed of phosphor bronze formed of tin (Sn), phosphorus (P), copper (Cu) and unavoidable impurities and having a tensile strength of 480 to 550 MPa, whereas a pierce plate 63 of the pierce terminal 6 piercing through the conductor 101 is formed of a copper alloy, which is a high strength conductive member having a higher strength than that of the conductor 101 and having conductivity.
Public/Granted literature
- US20090291587A1 CONNECTION STRUCTURE Public/Granted day:2009-11-26
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