Invention Grant
- Patent Title: Bus bar system, method, and kit
- Patent Title (中): 母线系统,方法和套件
-
Application No.: US12215365Application Date: 2008-06-26
-
Publication No.: US07704104B2Publication Date: 2010-04-27
- Inventor: Wayne C. Duley
- Applicant: Wayne C. Duley
- Agency: Williams Mullen
- Main IPC: H01R11/01
- IPC: H01R11/01

Abstract:
A replacement bus system having one or more conductive shafts supporting wire attachment lugs and spacers that ride along the conductive shaft; the spacers are conductive and separate the attachment lugs. The lugs and spacers may be secured onto the shaft by a locking mechanism. By providing a shaft on which the lugs may ride, the wires are configured transversely to conventional approaches, enabling a greater number of wires to be connected over a given length and a wider variety of relative orientation of wires. This configuration also enables much of the structure to be manufactured from stainless steel or other non cuprous metal, except for the spacers, which may be manufactured from tinned copper.
Public/Granted literature
- US20090004895A1 Bus bar system, method, and kit Public/Granted day:2009-01-01
Information query