Invention Grant
- Patent Title: Electrodeposited wire tool
- Patent Title (中): 电沉积线工具
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Application No.: US11666098Application Date: 2005-09-05
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Publication No.: US07704127B2Publication Date: 2010-04-27
- Inventor: Kazuaki Taniguchi , Masahiro Nakano , Yoshitaka Manita
- Applicant: Kazuaki Taniguchi , Masahiro Nakano , Yoshitaka Manita
- Applicant Address: JP Tokyo
- Assignee: Asahi Diamond Industrial Co., Ltd.
- Current Assignee: Asahi Diamond Industrial Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: The Nath Law Group
- Agent Jerald L. Meyer; Robert T. Burns
- Priority: JPP2004-380182 20041228
- International Application: PCT/JP2005/020537 WO 20050905
- International Announcement: WO2006/070534 WO 20060706
- Main IPC: B28D1/08
- IPC: B28D1/08

Abstract:
A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is formed on the surface of the super abrasive grains 16 to increase efficiency during electrodeposition. The thickness of the coating layer 20 formed on the super abrasive grains 16 is less than 0.1 μm, and preferably not more than 0.05 μm. The coating layer 20 is thin enough that its mass is less than 10% of the mass of the super abrasive grain 16. Accordingly, the super abrasive grains 16 are electrodeposited in a single layer around the outer peripheral face 14 of the core wire 12. As a result, the super abrasive grains 16 do not readily come off the core wire 12, which means that the wire tool will have a longer life. Also, since there is no need to remove any excess super abrasive grains after their electrodeposition, manufacturing costs can be cut and less work is entailed.
Public/Granted literature
- US20090120422A1 Electrodeposited wire tool Public/Granted day:2009-05-14
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