Invention Grant
- Patent Title: Semiconductor substrate cleaning method and semiconductor substrate cleaning machine
- Patent Title (中): 半导体衬底清洗方法和半导体衬底清洗机
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Application No.: US11702529Application Date: 2007-02-06
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Publication No.: US07704329B2Publication Date: 2010-04-27
- Inventor: Kenji Kobayashi , Hiroshi Oshita
- Applicant: Kenji Kobayashi , Hiroshi Oshita
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-031508 20060208
- Main IPC: B08B1/04
- IPC: B08B1/04
Abstract:
A semiconductor substrate cleaning method includes a first cleaning step of cleaning the surface of a semiconductor substrate with the use of a first brush and a second cleaning step of cleaning the surface of the semiconductor substrate with the use of a second brush after the first cleaning step. The second cleaning step is performed under a condition that suppresses recontamination of the surface of the semiconductor substrate in comparison with the first cleaning step.
Public/Granted literature
- US20070181153A1 Semiconductor substrate cleaning method and semiconductor substrate cleaning machine Public/Granted day:2007-08-09
Information query
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