Invention Grant
US07704408B2 Resin-molded component for signal reader and method for molding thereof
失效
用于信号读取器的树脂模制部件及其模塑方法
- Patent Title: Resin-molded component for signal reader and method for molding thereof
- Patent Title (中): 用于信号读取器的树脂模制部件及其模塑方法
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Application No.: US11283892Application Date: 2005-11-22
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Publication No.: US07704408B2Publication Date: 2010-04-27
- Inventor: Hiroki Fukatsu
- Applicant: Hiroki Fukatsu
- Applicant Address: JP Tokyo
- Assignee: Polyplastics Co., Ltd.
- Current Assignee: Polyplastics Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2004-344680 20041129
- Main IPC: C09K19/38
- IPC: C09K19/38 ; C08G63/06 ; C08L67/03 ; G11B7/22

Abstract:
The present invention provides a resin-molded component for signal reader, which is light in weight and is able to improve the vibration damping property and to increase the resonance frequency, and which is excellent in heat dissipation. Specifically, it provides a resin-molded component for signal reader structured by 55 to 75% by weight of liquid crystalline polymer (A) composed of structural units expressed by general formulae (I) through (IV): —O—Ar1—CO— (I) —CO—Ar2—CO— (II) —O—Ar3—O— (III) —O—Ar4—CO— (IV) (where, Ar1 is 2,6-naphthalene group, Ar2 is selected from 1,2-phenylene group, 1,3-phenylene group, and, 1,4-phenylene group, Ar3 is selected from 1,3-phenylene group, 1,4-phenylene group, and p,p′-polyphenylene group, and Ar4 is 1,4-phenylene group); 20 to 10% by weight of inorganic hollow sphere (B1); and 25 to 15% by weight of fibrous inorganic filler (B2), and has 1.4 or smaller specific gravity d, 0.5 W/m·K or larger thermal conductivity λ, and 10 GPa or larger flexural modulus.
Public/Granted literature
- US20060113391A1 Resin-molded component for signal reader and method for molding thereof Public/Granted day:2006-06-01
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