Invention Grant
US07704579B2 System for seaming high-modulus, high-tenacity, low-elongation fabrics
有权
缝合高模量,高强度,低伸长率织物的系统
- Patent Title: System for seaming high-modulus, high-tenacity, low-elongation fabrics
- Patent Title (中): 缝合高模量,高强度,低伸长率织物的系统
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Application No.: US11391747Application Date: 2006-03-29
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Publication No.: US07704579B2Publication Date: 2010-04-27
- Inventor: John F. Brewer , Dhiraj H. Darjee , David R. Dingler
- Applicant: John F. Brewer , Dhiraj H. Darjee , David R. Dingler
- Applicant Address: US MD Bethesda
- Assignee: Lockheed Martin Corporation
- Current Assignee: Lockheed Martin Corporation
- Current Assignee Address: US MD Bethesda
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
A seaming system for forming a seam is disclosed, wherein the seam consists of at least two opposed sections of high-modulus, high-tenacity, low-elongation fabric sections joined by a tape. The system comprises a seamer head, and a seamer base that includes a topography configured to impart a predetermined pressure gradient to the adhesive layer, tape, and fabric sections of the seam. The resultant seam has a cross-section or thickness profile that generally corresponds to that of the applied pressure gradient. As such, the constructed seam more efficiently distributes stress imparted from any applied load.
Public/Granted literature
- US20070238381A1 System and method for seaming high-modulus, high-tenacity, low-elongation fabrics Public/Granted day:2007-10-11
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