Invention Grant
- Patent Title: Cover tape and carrier tape system
- Patent Title (中): 覆盖胶带和载带系统
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Application No.: US10592091Application Date: 2005-04-25
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Publication No.: US07704591B2Publication Date: 2010-04-27
- Inventor: Takeshi Ono , Masanori Higano , Masanori Ishii , Takayuki Iwasaki
- Applicant: Takeshi Ono , Masanori Higano , Masanori Ishii , Takayuki Iwasaki
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-129131 20040426; JP2004-185262 20040623; JP2004-307675 20041022
- International Application: PCT/JP2005/007842 WO 20050425
- International Announcement: WO2005/102860 WO 20051103
- Main IPC: B32B27/32
- IPC: B32B27/32 ; G11B5/64
Abstract:
A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 μm, and has an antistatic agent applied thereon to form an antistatic layer.
Public/Granted literature
- US20070184243A1 Cover tape, and carrier tape system for packing electronic component Public/Granted day:2007-08-09
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