Invention Grant
- Patent Title: CCD type solid-state imaging apparatus and manufacturing method for the same
- Patent Title (中): CCD型固体摄像装置及其制造方法
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Application No.: US11455102Application Date: 2006-06-19
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Publication No.: US07704775B2Publication Date: 2010-04-27
- Inventor: Shinji Uya
- Applicant: Shinji Uya
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch Stewart, Kolasch & Birch, LLP
- Priority: JPP.2005-186488 20050627
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The invention provides CCD type solid-state imaging apparatus comprises: photoelectric conversion elements; a plurality of first transfer paths extending in a first direction; and second transfer paths extending in a first direction; the first transfer paths and the second transfer paths respectively including a plurality of discretely formed first layer transfer electrode films and second layer transfer electrode films formed between the first layer transfer electrode films and whose ends are laminated on the ends of the adjacent first layer transfer electrode films via insulating films. The thickness of the insulating film between the first layer transfer electrode film and the second layer transfer electrode film constituting the second transfer path shown is smaller than the thickness of the insulating film between the first layer transfer electrode film and the second layer transfer electrode film constituting the first transfer path shown.
Public/Granted literature
- US20060290799A1 CCD type solid-state imaging apparatus and manufacturing method for the same Public/Granted day:2006-12-28
Information query
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