Invention Grant
- Patent Title: Microlens structure for image sensors
- Patent Title (中): 图像传感器的微透镜结构
-
Application No.: US11181508Application Date: 2005-07-14
-
Publication No.: US07704778B2Publication Date: 2010-04-27
- Inventor: Ming-Chang Kao , Chih-Kung Chang , Fu-Tien Weng , Bii-Junq Chang
- Applicant: Ming-Chang Kao , Chih-Kung Chang , Fu-Tien Weng , Bii-Junq Chang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The energy used with each exposure process is less than the energy required if a single exposure is used. Furthermore, the masks used for each exposure may differ. In an embodiment, the masks are varied so as to create a notch in the upper corner of the microlens.
Public/Granted literature
- US20060189024A1 Microlens structure for image sensors Public/Granted day:2006-08-24
Information query
IPC分类: