Invention Grant
- Patent Title: Method of manufacturing conductive pattern and electronic device, and electronic device
- Patent Title (中): 制造导电图案和电子装置的方法以及电子装置
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Application No.: US10599131Application Date: 2005-10-14
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Publication No.: US07704783B2Publication Date: 2010-04-27
- Inventor: Tohru Nakagawa
- Applicant: Tohru Nakagawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2004-301146 20041015
- International Application: PCT/JP2005/018942 WO 20051014
- International Announcement: WO2006/041153 WO 20060420
- Main IPC: H01L51/40
- IPC: H01L51/40

Abstract:
The manufacturing method includes forming a molecular film 16 of at least one kind of molecule on a part of a conductive film 13 by placing, on the conductive film 13, a solution 12 containing the one kind of molecule dissolved therein, with the one kind of molecule being selected from the group consisting of: a molecule expressed by Formula (1): CF3(CF2)n(CH2)mSH, where n indicates a natural number of 3 to 7 while m denotes a natural number of 8 to 18; and a molecule expressed by Formula (2): CF3(CF2)p(CH2)qSS(CH2)q′(CF2)p′CF3, where p and p′ each are a natural number of 3 to 7 independently while q and q′ each are a natural number of 8 to 18 independently. Subsequently, the conductive film 13 located in a part where the molecular film 16 has not been formed is removed by bringing the conductive film 13 into contact with an etchant for the conductive film 13. Thus, a conductive pattern 17 is formed.
Public/Granted literature
- US20070196577A1 Method of manufacturing conductive pattern and electronic device, and electronic device Public/Granted day:2007-08-23
Information query
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