Invention Grant
- Patent Title: Method of manufacturing a carrier member for electronic components
- Patent Title (中): 电子部件用承载部件的制造方法
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Application No.: US11454086Application Date: 2006-06-16
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Publication No.: US07704790B2Publication Date: 2010-04-27
- Inventor: Yuichi Morinaga , Hisao Yamagata , Toru Makanae
- Applicant: Yuichi Morinaga , Hisao Yamagata , Toru Makanae
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, P.C.
- Priority: JP2005-178528 20050617
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L21/30 ; H01L21/46

Abstract:
Plural inlets 1 are formed by a separation into individual pieces, and these plural inlets are arranged to a tape-like carrier such that the long side of each of the plural inlets is along the longitudinal direction of the tape-like carrier, whereby cost can be reduced by rearranging the inlets to the cheap tape-like carrier. Further, the plural inlets formed by separating into individual pieces are rearranged onto the tape-like carrier, whereby the change of the arrangement pitch of the inlets so as to correspond to the size of a final product at a customer side can be facilitated, and days taken for the development for newly supplying the inlets can be shortened.
Public/Granted literature
- US20060283467A1 Method of manufacturing a carrier member for electronic components Public/Granted day:2006-12-21
Information query
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