Invention Grant
- Patent Title: On-chip heater and methods for fabrication thereof and use thereof
- Patent Title (中): 片上加热器及其制造方法及其应用
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Application No.: US11419341Application Date: 2006-05-19
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Publication No.: US07704847B2Publication Date: 2010-04-27
- Inventor: Ethan H. Cannon , Alvin W. Strong
- Applicant: Ethan H. Cannon , Alvin W. Strong
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Richard M. Kotulak, Esq.
- Main IPC: H01L21/762
- IPC: H01L21/762
Abstract:
An on-chip heater and methods for fabrication thereof and use thereof provide that the heater is located within an isolation region that in turn is located within a semiconductor substrate. The heater has a thermal output capable or raising the semiconductor substrate to a temperature of at least about 200° C. The heater may be used for thermally annealing trapped charges within dielectric layers within the semiconductor structure.
Public/Granted literature
- US20070268736A1 ON-CHIP HEATER AND METHODS FOR FABRICATION THEREOF AND USE THEREOF Public/Granted day:2007-11-22
Information query
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