Invention Grant
- Patent Title: Polyarylene sulfide resin composition
- Patent Title (中): 聚芳硫醚树脂组合物
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Application No.: US12085912Application Date: 2006-12-13
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Publication No.: US07705079B2Publication Date: 2010-04-27
- Inventor: Hidemi Kondoh , Yoshihito Fukasawa , Hiroyuki Monde
- Applicant: Hidemi Kondoh , Yoshihito Fukasawa , Hiroyuki Monde
- Applicant Address: JP Tokyo JP Osaka
- Assignee: Polyplastics Co., Ltd.,Otsuka Chemical Co., Ltd.
- Current Assignee: Polyplastics Co., Ltd.,Otsuka Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo JP Osaka
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2005-362684 20051216
- International Application: PCT/JP2006/325309 WO 20061213
- International Announcement: WO2007/069770 WO 20070621
- Main IPC: C08K3/22
- IPC: C08K3/22

Abstract:
The present invention provides a polyarylene sulfide resin composition which shows high dielectric constant and low dielectric dissipation factor, has excellent moldability, and has improved corrosive property to metal parts. More specifically, to 100 parts by weight of (A) polyarylene sulfide resin, compounded are 10 to 400 parts by weight of (B) an alkaline earth metal titanate showing 50 or higher relative dielectric constant and 0.05 or lower dielectric dissipation factor at 1 MHz, and containing less than 500 ppm of metal ion which is extracted by hot water; and 0.01 to 15 parts by weight of (C) one or more compound selected from hydroxides and oxides of alkaline earth metals.
Public/Granted literature
- US20090253843A1 Polyarylene Sulfide Resin Composition Public/Granted day:2009-10-08
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