Invention Grant
- Patent Title: Compact differential signal via structure
- Patent Title (中): 紧凑型差分信号通孔结构
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Application No.: US11965811Application Date: 2007-12-28
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Publication No.: US07705246B1Publication Date: 2010-04-27
- Inventor: Jason Pritchard , Michael Gnieski
- Applicant: Jason Pritchard , Michael Gnieski
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11
Abstract:
A differential signal via structure for a printed circuit board having a pair of signal vias extending vertically from a surface of the board to an interior region of the board to contact signal conductors disposed horizontally within the interior region of the board and a pair of ground vias extending vertically from a surface of the circuit board to an interior region of the board to contact ground conductors disposed horizontally within the interior region of the board.
Information query
