Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11957270Application Date: 2007-12-14
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Publication No.: US07705358B2Publication Date: 2010-04-27
- Inventor: Satoru Okamoto , Keiichi Sekiguchi
- Applicant: Satoru Okamoto , Keiichi Sekiguchi
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2006-343412 20061220
- Main IPC: H01L27/14
- IPC: H01L27/14

Abstract:
It is an object to improve operation characteristics and reliability of a semiconductor device. A semiconductor device which includes an island-shaped semiconductor film having a channel-formation region, a first low-concentration impurity region, a second low-concentration impurity region, and a high-concentration impurity region including a silicide layer; a gate insulating film; a first gate electrode overlapping with the channel-formation region and the first low-concentration impurity region with the gate insulating film interposed therebetween; a second gate electrode overlapping with the channel-formation region with the gate insulating film and the first gate electrode interposed therebetween; and a sidewall formed on side surfaces of the first gate electrode and the second gate electrode. In the semiconductor device, a thickness of the gate insulating film is smaller in a region over the second low-concentration impurity region than in a region over the first low-concentration impurity region.
Public/Granted literature
- US20080150027A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-06-26
Information query
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