Invention Grant
US07705392B2 Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device
有权
非易失性半导体器件及制造非易失性半导体器件的方法
- Patent Title: Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device
- Patent Title (中): 非易失性半导体器件及制造非易失性半导体器件的方法
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Application No.: US11402972Application Date: 2006-04-13
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Publication No.: US07705392B2Publication Date: 2010-04-27
- Inventor: Yasuaki Yonemochi , Hisakazu Otoi , Akio Nishida , Shigeru Shiratake
- Applicant: Yasuaki Yonemochi , Hisakazu Otoi , Akio Nishida , Shigeru Shiratake
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-118505 20050415
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.
Public/Granted literature
- US20060231884A1 Nonvolatile semiconductor device and method of manufacturing nonvolatile semiconductor device Public/Granted day:2006-10-19
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