A package structure having a semiconductor chip embedded therein and a method of fabricating the same are disclosed. The package structure comprises: an aluminum oxide composite plate and a semiconductor chip. The aluminum oxide composite plate is formed by a stack consisting of an adhesive layer placed in between two aluminum oxide layers. The semiconductor chip having an active surface a plurality of electrode pads disposed thereon can be embedded and secured in the aluminum oxide composite plate. The present invention also comprises a method of fabricating the above-mentioned package structure. The present invention provides an excellent package structure, which can decrease the thickness of the package structure and make the package structure having characteristics of high rigidity and enduring tenacity at the same time.