Invention Grant
US07705458B2 Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
有权
散装金属玻璃焊料，泡沫块状金属玻璃焊料，芯片封装中的泡沫焊接焊盘，组装方法和含有其的体系
- Patent Title: Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
- Patent Title (中): 散装金属玻璃焊料，泡沫块状金属玻璃焊料，芯片封装中的泡沫焊接焊盘，组装方法和含有其的体系
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Application No.: US11425353Application Date: 2006-06-20
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Publication No.: US07705458B2Publication Date: 2010-04-27
- Inventor: Daewoong Suh , Yongki Min
- Applicant: Daewoong Suh , Yongki Min
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L23/488
- IPC: H01L23/488
Abstract:
A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic glass electrical connection is used as a solder bump for communication between an integrated circuit device and external structures. A process of forming the foamed bulk metallic glass electrical connection includes mixing bulk metallic glass with a blowing agent.
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