Invention Grant
- Patent Title: Integrated circuit package system
- Patent Title (中): 集成电路封装系统
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Application No.: US11462303Application Date: 2006-08-03
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Publication No.: US07705475B2Publication Date: 2010-04-27
- Inventor: Hyung Jun Jeon , Tae Keun Lee , Sung Soo Kim
- Applicant: Hyung Jun Jeon , Tae Keun Lee , Sung Soo Kim
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
An integrated circuit package system is provided including forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.
Public/Granted literature
- US20080029911A1 INTEGRATED CIRCUIT PACKAGE SYSTEM Public/Granted day:2008-02-07
Information query
IPC分类:
