Invention Grant
- Patent Title: Broadband micro-machined thermal power sensor
- Patent Title (中): 宽带微加工热功率传感器
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Application No.: US11735879Application Date: 2007-04-16
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Publication No.: US07705582B2Publication Date: 2010-04-27
- Inventor: Karam Michael Noujeim
- Applicant: Karam Michael Noujeim
- Applicant Address: US CA Morgan Hill
- Assignee: Anritsu Company
- Current Assignee: Anritsu Company
- Current Assignee Address: US CA Morgan Hill
- Agency: Fliesler Meyer LLP
- Main IPC: G01R23/04
- IPC: G01R23/04 ; G01R25/02 ; G01N25/00 ; G01J5/00

Abstract:
A power sensor includes a substrate, an aperture within the substrate, a membrane formed over at least a portion of the substrate and extending over the aperture, and an electro-thermal transducer partially supported by the insulating membrane. The electro-thermal transducer includes an impedance matched, bifurcated load supported over the aperture by the insulating membrane, and a thermopile extending over the aperture and supported by the insulating membrane, the thermopile being adapted to generate a voltage in response to heat generated in the impedance matched, bifurcated load. A signal conductor is electrically connected with one end of the impedance matched, bifurcated load to guide electromagnetic signals to the load, and a conductive under-layer stratified from the signal conductor by an intermediary dielectric is connected with an opposite end of the impedance matched, bifurcated load to act as a ground plane.
Public/Granted literature
- US20080252298A1 BROADBAND MICRO-MACHINED THERMAL POWER SENSOR Public/Granted day:2008-10-16
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