Invention Grant
- Patent Title: Camera module with improved leaf spring attachment
- Patent Title (中): 相机模块具有改进的板簧附件
-
Application No.: US11846315Application Date: 2007-08-28
-
Publication No.: US07705909B2Publication Date: 2010-04-27
- Inventor: Takashi Ishizawa , Tomohiko Osaka
- Applicant: Takashi Ishizawa , Tomohiko Osaka
- Applicant Address: JP
- Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee: Mitsumi Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Marger Johnson & McCollom, P.C.
- Priority: JP2006-236883 20060831
- Main IPC: H04N5/232
- IPC: H04N5/232 ; H04N5/225 ; G03B13/00 ; G02B7/02

Abstract:
A camera module for small digital cameras and camera-equipped cellular phones includes a lens unit; a holder housing the lens unit and displaceable along an optical axis; a coil on the holder; a yoke and magnets in the yoke providing a magnetic field to the coil; a leaf spring for supporting the holder; and an imaging element below the lens unit. The leaf spring includes an outer annular portion attached to the yoke, an inner annular portion attached to the holder, and bridge portions coupled between the outer and inner annular portion to resiliently support the inner annular portion. Each bridge portion has an outer and an inner annular portion side base part, and extends between an inner peripheral edge of the outer annular portion and an outer peripheral edge of the inner annular portion, the outer annular portion welded to the top surface of the yoke.
Public/Granted literature
- US20080055456A1 CAMERA MODULE Public/Granted day:2008-03-06
Information query