Invention Grant
US07706116B2 SSPC technology incorporated with thermal memory effects to achieve the fuse curve coordination
有权
SSPC技术结合了热记忆效应，实现了熔丝曲线协调
- Patent Title: SSPC technology incorporated with thermal memory effects to achieve the fuse curve coordination
- Patent Title (中): SSPC技术结合了热记忆效应，实现了熔丝曲线协调
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Application No.: US11655991Application Date: 2007-01-22
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Publication No.: US07706116B2Publication Date: 2010-04-27
- Inventor: Zhenning Z Liu , Ted J. Gayowsky , Randy J. Fuller , Wenjiang Yu , Yang Ye , Daniel G Filimon , Boris Plivcic , That Nguyen
- Applicant: Zhenning Z Liu , Ted J. Gayowsky , Randy J. Fuller , Wenjiang Yu , Yang Ye , Daniel G Filimon , Boris Plivcic , That Nguyen
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Oral Caglar, Esq.
- Main IPC: H02H9/02
- IPC: H02H9/02 ; H02H5/04
Abstract:
Methods and apparatuses implement a thermal memory effect for a solid state power controller. A solid state power controller trip apparatus with thermal memory according to one embodiment comprises: a trip module including a first capacitor (156) and a counter (174), wherein the first capacitor (156) charges multiple times, when an over current event occurs, and the counter (174) accumulates a count related to the charging of the first capacitor (156) for the multiple times, to detect a trip condition; and a discharging module connected to the trip module, the discharging module including a resistor (166) and a second capacitor (158), wherein an electrical parameter associated with the count decays with time using the resistor (166) and the second capacitor (158).
Public/Granted literature
- US20080174928A1 SSPC technology incorporated with thermal memory effects to achieve the fuse curve coordination Public/Granted day:2008-07-24
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